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SiC - Silicon Carbide Wafer Precision CNC Multifunctional Cylindrical Grinding Machine Start Testing

Zäit: 2022-12-08 Hits: 11

YUHUAN Start Testing a New Model YHMGK1720 Precision CNC Multifunctional Cylindrical Grinding Machine.

Silicon Carbide Wafer Precision CNC Multifunctional Cylindrical Grinding MachineSilicon Carbide Wafer Precision CNC Multifunctional Cylindrical Grinding Machine 1

This Precision CNC Multifunctional Cylindrical Grinding Machine YHMCK1720 Can Grinding the

SIC or Sapphire Wafer ,which the Diameter  of it can support φ100~φ210mm,The Width Range 

will be about 10~500mm.Cylindrical precision can be 0.01mm.